IT之家 9 月 30 日消息，当地时间 9 月 30 日，新思科技宣布与亚马逊达成多年期定制芯片 IP 战略合作协议，合作范围进一步拓展至云端及 AI 赋能的工程研发领域。
官方表示，借助引入新思科技的芯片知识产权以及 AI 驱动的工程软件应对思路，将加速亚马逊定制芯片与 AWS 基础设施的工程研发进程。
双方达成多年期、总额超 10 亿美元（IT之家注：现汇率约合 67.18 亿元人民币）的合作协议，新思科技将借助 AWS 服务加快自身机型迭代步伐，并与亚马逊协同针对 Trainium 与 Graviton 芯片深度优化新思科技旗下的软件工具。
另外，新思科技工程团队还将全面引入亚马逊弹性计算云（Amazon EC2）与 Amazon Bedrock，以此加速其前沿机型的开发效率。
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IT之家 news on September 30: On September 30 local time, Synopsys announced a multi-year strategic cooperation agreement with Amazon on custom chip IP, further expanding the cooperation scope into the cloud and AI-empowered engineering R&D field.
Officials said that introducing Synopsys' chip intellectual property and AI-driven engineering software approaches will accelerate the engineering R&D of Amazon's custom chips and AWS infrastructure.
The two parties reached a multi-year cooperation agreement totaling over $1 billion (IT之家 note: approximately RMB 6.718 billion at the current exchange rate). Synopsys will leverage AWS services to accelerate its own model iteration pace and collaborate with Amazon to deeply optimize Synopsys' software tools for Trainium and Graviton chips.
In addition, Synopsys' engineering team will fully adopt Amazon Elastic Compute Cloud (Amazon EC2) and Amazon Bedrock to accelerate the development efficiency of its cutting-edge models.