IT之家 9 月 30 日消息，据中国光谷公众号，9 月 30 日，湖北星辰工艺有限公司（以下简称“星辰工艺”）先进封装中试平台二期项目正式通线。这是国内首条 3D 先进封装量产线，标志着我国向高端芯片先进封装自主可控又迈出坚实一步。
IT之家获悉，星辰工艺先进封装综合实验平台一期、二期合计投资超 70 亿元，二期项目从 2025 年 10 月开工，今年 3 月完成主厂房封顶，6 月 30 日首批核心工艺设备进场搬入，到主生产设备安装调试，以及水、气、化等生产配套平台全面贯通，软件平台联调联试完成，11 个月达成通线节点。
据介绍，二期项目在提高一期工艺水平的基础上，跨越风险量产到批量量产的环节。产线全面建成后，可同步承载 40 至 50 款芯片的中试与风险量产，以及 30 至 40 套国产半导体设备与材料的表现验证。二期还补齐了 2.5D 中试能力，使星辰工艺同时具备 2.5D 和 3D 先进封装工艺，面向高表现 AI 算力、智能终端、感存算一体及光电集成等芯片给出封装量产服务。
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IThome, September 30: According to the WeChat account of China Optics Valley, on September 30, the Phase II project of the Advanced Packaging Pilot Testing Platform of Hubei Xingchen Gongyi Co., Ltd. (hereinafter referred to as "Xingchen Gongyi") was officially completed. This is the first domestic 3D advanced packaging mass production line, marking a solid step forward for China in achieving autonomy and controllability in advanced packaging for high-end chips.
IThome learned that the total investment in Phase I and Phase II of Xingchen Gongyi's Advanced Packaging Comprehensive Experimental Platform exceeds 7 billion yuan. The Phase II project broke ground in October 2025, the main plant reached the structural completion milestone in March this year, the first batch of core process equipment moved in on June 30, the main production equipment installation and debugging was completed, the comprehensive interconnection of production support platforms for water, gas, and chemicals was achieved, and the joint debugging of the software platform was completed, reaching the line completion milestone within 11 months.
It is reported that, on the basis of improving the process level of Phase I, the Phase II project bridges the gap from risk mass production to batch mass production. After the production line is fully built, it will be capable of simultaneously hosting pilot testing and risk mass production for 40 to 50 chip models, as well as performance validation for 30 to 40 sets of domestic semiconductor equipment and materials. Phase II also fills in the 2.5D pilot testing capability, enabling Xingchen Gongyi to possess both 2.5D and 3D advanced packaging processes, providing packaging mass production services for chips targeted at high-performance AI computing power, smart terminals, sense-compute-integration, and optoelectronic integration.