E Ink 近日对美国私营科技初创公司 NewCopper 进行了重要战略投资。NewCopper 专注于导电铜浆（铜墨水）材料的开发，其技术源自马里兰大学与耶鲁大学的联合研究成果，并已获得马里兰大学关于该专有铜浆配方的独家授权。
随着柔性电子在显示、传感器、太阳能、RFID 以及各类联网设备中的渗透率不断提升，制造商正在寻找高成本银浆的替代方案。银浆目前被广泛用于印刷电子元件中的导电通路。铜具备良好的导电性且材料成本更低，但其易氧化的问题长期限制了大规模应用。NewCopper 开发出一种专有的低温、反应型且可自钝化的铜浆配方，专门用于解决这一难题。
E Ink 将通过 post-money 形式的未来股权简单协议（SAFE）完成本次投资，并依托自身在显示制造方面的经验，支持 NewCopper 扩大产能并推进商业化。由于 NewCopper 的配方与 E Ink 的卷对卷涂布工艺相兼容，这笔投资也为 E Ink 研发团队评估铜浆作为未来显示与电极材料的可能性提供了机会。更广泛地看，双方合作将强化先进电子材料的本地化供应链，并支撑电子纸部件的未来量产。
E Ink 董事长兼首席执行官李政昊表示：“E Ink 本身就是从学术界走出来的全球性科技公司，因此我们既理解 NewCopper 创新的前景，也清楚把突破性技术从实验室推向市场有多难。作为材料与显示制造领域的老牌领导者，帮助有潜力的企业实现规模化是我们的责任。通过资源、专业能力与商业化经验支持 NewCopper，我们也能够推动显示产业迈向新的高度。”
（本文由 Good e-Reader 报道，中文由编辑整理翻译）
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E Ink recently made a strategic investment in NewCopper, a US-based private technology startup specializing in conductive copper paste (copper ink) materials. NewCopper's technology is based on joint research between the University of Maryland and Yale University, and the company has secured exclusive licensing for the proprietary copper paste formulation from the University of Maryland.
With flexible electronics increasingly penetrating into display, sensor, solar, RFID, and connected device applications, manufacturers are seeking alternatives to costly silver pastes currently used for conductive paths in printed electronics. Copper offers good conductivity and lower material costs but has long been limited by oxidation issues. NewCopper has developed a proprietary low-temperature, reactive, and self-passivating copper paste formulation specifically to address this challenge.
E Ink's investment, structured as a post-money Simple Agreement for Future Equity (SAFE), leverages its display manufacturing expertise to support NewCopper's scaling and commercialization. The compatibility of NewCopper's formulation with E Ink's roll-to-roll coating processes also allows E Ink to evaluate copper paste for future display and electrode applications. Furthermore, the collaboration strengthens the localized supply chain for advanced electronic materials and supports the future production of e-paper components.
E Ink Chairman and CEO Johnson Lee stated, "As a global technology company that grew out of academia, we understand both the promise of NewCopper's innovation and the difficulty of bringing a breakthrough technology from the lab to market. Supporting promising companies with scaling challenges is part of our responsibility and legacy as established leaders in materials and display fabrication. By providing resources, expertise, and a pathway to commercialization, we are helping elevate the display industry."
(This article was reported by Good e-Reader and edited/translated by the editor.)